Die Attach / Die Bonding
Beckermus related capabilities
Placement accuracy down to ±1 µ
Manual/Automatic die attach
Dispensing - Time-pressure, auger and JET
Die types: CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers etc.
Substrates: FR4, FLEX, Ceramics, Glass, Silicon, Teflon, Diamond, Lead frames etc.
Die bonding, is also known as Die Attach, Die Placement or Die Bond. This is the process of attaching/bonding a die (a chip) to a printed circuit board (PCB) or inside a package.
Die Bonding and Wire Bonding are the two main actors of the IC Assembly process
Die Attach Materials
In BECKERMUS we are experienced with most of known die types and materials.
Die types we assemble: ASIC, CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers and more.
Substrates (PCB) we use: FR4, FLEX, Ceramics, Glass, Silicon, Teflon, Diamond, Lead frames and more.
The die, adhesives and substrates are selected according to the project specifications and requirement.
Die Attach Process
The most common bare die attachment method is the Epoxy Die Attach. We perform both manual and automatic epoxy die attachment, offering both conductive and non-conductive alternatives.
The dies can be picked up straight from the wafer, gelpack or waffle-pack.
Die bonding accuracy (depends on the requirement) can be up to 1 micron, and is available for dies as thin as 50 microns or more.
Variety of optional dispensing options are: line dispensing, dot dispensing or any other custom shape, using time-pressure or auger dispenser.
Eutectic Die Attach is recommended for projects requiring high-end thermal conductivity. The process involves heating the substrate to the melting point, attaching the die, and then cooling it down to complete the bond cycle, creating an intermetallic bond