Micro Electronics Services

Beckermus Technologies specializes in micro assembly and provides IC Assembly services in microelectronics, micro-optics, optoelectronics and photonic for over 20 years. During the last two decades our team had the privilege of working closely and growing side by side with the Israeli and global high-tech sectors.

 

Our services encompass both the standard assembly services and the most advanced ones.

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Wire Bonding

The term wire bond or wire bonding is a Micro Assembly service used to describe the process of connecting between a bare ... Read More

Die Attach

Die bonding, is also known as Die Attach, Die Placement or Die Bond. This is the process of attaching/ bonding a die ... Read More

Flip Chip

Beckermus Technologies offers Flip Chip Assembly Bonding services to projects that require ... Read More

Chip on board / Chip on flex

Beckermus Technologies is capable of assembling the bare die on multiple types of substrates and achieve highly complicated ... Read More

System in package (SiP)  / Multi chip module (MCM)

No two projects are the same. We, in Beckermus Technologies understand that each client ... Read More

Wafer level packaging

The traditional packaging process includes an initial process of wafer dicing and moving the dies into special waffle ... Read More

Encapsulation

We, in Beckermus Technologies, understand that the  microelectronic products that we assemble for our customers are ... Read More

3D Stacked Dies

Beckermus Technologies offers its clients multiple advanced packaging Techniques. Stacked Dies can be performed straight ... Read More

Wafer Dicing / Sorting

One of the first steps in micro assembly is the process of wafer dicing. We, in Beckermus Technologies offer ... Read More

© 2017 Beckermus Technologies LTD.

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