Products Gallery

Partial list of products made in Beckermus

Have any question? Contact a Beckermus expert

Chip On Board + Lens Attach

FlipChip Assembly

Multi Chip Module

Pull Test

IC Packaging 03

IC Packaging 01

        VCSEL Array Assembly

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Ultra FinePitch Wire bonding

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Wire bonding

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BVA Wire Bonds

1/1

Laser Emitter Assembly

1/1

AL Wedge Wire Bonding

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FlipChip Assembly

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3 Layers Wire bonding

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© 2017 Beckermus Technologies LTD.

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