Beckermus related capabilities
Dam & Fill
Low Profile Encapsulation
Dispensing - time-pressure, screw system
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We, in Beckermus Technologies, understand that the microelectronic products that we assemble for our customers are constantly facing a variety of challenges and should keep performing in difficult environments. For example, an IC assembled product may be required to perfectly perform inside the human body and is usually planned to expire in no less than 10 years. Other examples of conditions that microelectronic devices are expected to resist contain humid environments,ionic contamination, severe heat and even radiation.
Encapsulation of the bare die (IC) has proved itself to be a valid solution for most of the challenges described above. Please note that encapsulation can also be used as a security measure and in order to prevent reverse engineering and securing the product’s IP.
Our technical team offers a wide range of encapsulation solutions and will advise you regarding the most suitable one for your device;
Glob Top - Wire bonded chip (in most of the cases) is fully encapsulated using an epoxy adhesive. The package has a domed surface.
In cases that the chip is relatively thick , it is recommended to use Dam and Fill method.
which is full encapsulation that is achieved in a 2 steps process. On the first step a Dam is created around the bonded bare die. The second step includes filling of the to complete the encapsulation.
Partial Encapsulation - some projects require that the chip(s) are only partially encapsulated. This method is frequently used for devices that involve images sensors (CMOS/ CCD), lasers, or other components that require an exposed die.
UnderFill - a technique that is mostly used in Flip Chip projects and for BGA/Micro BGA. When the attached die is not wired to the PCB and is only connected through balls/bumps, for most of the applications it is recommended to fill non-conductive epoxy under the chip to achieve physical strength.