Flip Chip bonding mostly used in projects with challenging dimensions and/or electrical performance requirement:

 

1. Dimensions: Flip Chip is an optimal solution when space is limited. Since the bumps are located under the chip itself, attaching it does not consume any extra space. No additional space is required in either  peripheral or height axis

 

2. Electrical Performance: In RF dies - when frequency is very high, preferring solder balls over wire bonding greatly reduces inductance. For example, flip chip’s improves heat dispersion allows safe high-speed signals transmission, which is a basic demand in most RF products.

 

The first step in the Flip Chip process includes the mounting of solder / gold bumps on the bottom side of the die.This step is performed while the chips are still on the wafer.

 

On the second step, the die is flipped so the bumps are attached to the substrate. The completed process most likely will include Underfill, which will help to gain physical strength of the assembly.

 

Many of Beckermus Technologies projects include both wire bonding and flip chip bonding. The bonding technique is selected based on its adherence to the project specification and is aimed to maximize quality and efficiency.