Sip Design
System-in-Package (SiP) design is at the forefront of microelectronic innovation, integrating multiple components such as processors, memory, sensors, and RF modules into a single compact package.
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Customized IC packages
Beckermus related capabilities
- Flexible design support with DFM/DFX guidelines for custom shapes and application-specific features.
- Rapid prototyping for small volumes and iterative development.
- Electrical Interconnect Design
Beckermus Technologies specializes in designing advanced microelectronic packages that meet the demands of modern applications. From ceramic and organic packages to hybrid designs our expertise includes creating open cavity packages such as QFN, SOIC, DFN, and other high-performance types. These designs optimize thermal management, electrical connectivity, and reliability while accommodating the miniaturization needs of today’s cutting-edge technologies. By tailoring solutions to your product’s specifications, we ensure compatibility, functionality, and seamless integration into your systems
Beckermus Technologies specializes in designing advanced microelectronic packages that meet the demands of modern applications. From ceramic and organic packages to hybrid designs our expertise includes creating open cavity packages such as QFN, SOIC, DFN, and other high-performance types. These designs optimize thermal management, electrical connectivity, and reliability while accommodating the miniaturization needs of today’s cutting-edge technologies. By tailoring solutions to your product’s specifications, we ensure compatibility, functionality, and seamless integration into your systems
