Design


Jigs & tools

Beckermus technologies provides full in-house development of custom mechanical tooling, including jigs, fixtures, and pick-up head, specifically engineered to support the unique requirements

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Customized IC packages

Beckermus Technologies specializes in designing advanced microelectronic packages that meet the demands of modern applications. From ceramic and organic packages to hybrid designs our expertise includes creating open cavity packages such

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Design for manufacturing

Our Design for Manufacturing (DFM) services ensure that your product is engineered for seamless, high-precision production from the outset. We analyze your design specifications alongside

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Electrical Design

Our electrical design expertise encompasses the development of circuit ladesigns that deliver peak performance and reliability. Wheyouts, signal integrity optimization,

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Sip Design

System-in-Package (SiP) design is at the forefront of microelectronic innovation, integrating multiple components such as processors, memory, sensors, and RF modules into a single compact package.

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Substrate Design

Beckermus Technologies offers comprehensive printed circuit board (PCB) design services tailored to the evolving needs of cutting-edge technologies across multiple domains. Our expertise spans the development of multi-layer

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