Beckermus Technologies specializes in bare die assembly, Our advanced capabilities include handling ultra-miniature components, high-density interconnects, and direct die bonding to substrates or packages, Whether working with RF amplifiers, MEMS sensors, or microprocessors, with our expertise in precision wire bonding, die attach, and encapsulation, we ensure high reliability and performance tailored to demanding applications
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Our photonics assembly services are tailored to address the intricate challenges of integrating optical and electronic components with precision and reliability. We excel in assembling photonic ICs (PICs) & devices, including laser diodes, photodetectors, optical transceivers, fiber-coupled modules, and high-complexity optical systems. These assemblies are essential for applications
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Our Hybrid Flexible Electronics (HFE) Assembly Services offer innovative solutions for integrating printed electronic circuits with traditional components to create high-performance, flexible, and cost-effective devices. Specializing in the assembly of flexible circuits, sensors, and hybrid modules using sheet-to-sheet (S2S) and roll-to-roll (R2R) technology, we support applications across industries such
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