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01 תמונת מגוז בקרמוס

About us

Beckermus Technologies is a privately-owned company, our company provides advanced microelectronics & micro optics assembly services, we specializes in the assembly of complex electro-optic modules based on 'bare dies'  from all sort of sectors and applications: from medical devices to communications, automotive, AR\VR, defense and more, our experience and expertise is in providing full TK solutions for start-ups and R&D teams from prototype level to mass production.

 growing with this industry for so many years we have accumulated invaluable knowledge and insights which offer a distinct advantage to our customers.


We comply with ISO 13485 for Medical devices, AS9100D for aerospace as well as the IPC-A-610 & MILL-STD 883.

Micro Electronics

  • Wire bonding

  • Die Attach

  • Flip chip

  • Chip on board / Flex

  • Inert soldering

  • System in Package

  • Multi chip modules

  • Wafer Level packaging

  • Encapsulation

  • 3D Stack dies

  • Wafer dicing

  • Wafer sorting


Short lead times

Micro Optics /Photonics

  • Optical modules assembly

  • Photonic components assembly

  • 6 Axis Automatic active alignment

  • Fiber coupling

  • High precision Lens placement and alignment

  • Photodiodes, High power Lasers and LEDs

  • MTF  live measurements

  • Custom optical alignment tools, jigs and software


accessible and dedicated engineering team


From R&D to


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Contact Us

Contact Us

Beckermus Technologies Ltd

Building 1 -
Headquarter, NPI / R&D Center.
29 Ha-Eshel St. P.O. Box 3561
South Industrial Park Caesarea,
Israel , 3088900

Tel: +972-4-6230055
Fax: +972-4-6230083

​Building 2 -
Production Facilities.
15 Harduf Hanechalim St.
South Industrial Park Caesarea,
Israel , 3088900

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