Advaced Micro-electronics & Electro-optical packaging

About Us

At Beckermus Technologies, we specialize in delivering comprehensive end-to-end solutions in microelectronic and electro-optical packaging.
Established in 1998, our foundation is built on innovation and technological advancement. We excel in 'bare die' assembly across diverse, high-demand sectors, including medical devices, communications, automotive, AR/VR, defense, aerospace, and more. Our expertise spans the full product lifecycle, from design and prototyping to full turnkey solutions for serial production.
With a customer-centered approach, we provide tailored solutions to address the unique needs and challenges of our global clients. Led by a skilled team dedicated to excellence, Beckermus continually developing innovative assembly methods and services to drive efficiency, productivity, and overall success.

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Our Services

Design
  • Design for manufacturing (DFM)
  • Packages Design
  • Substrate Design
  • Electrical Design
  • Optical Design
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Assembly
  • Microelectronic, RF & MEMS
  • Photonics
  • HFE (Hybrid Flexible Electronics)
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Manufacturing
  • Custom made packages
  • Custom made substrates
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Verification & Testing
  • Development & implementation of testing equipment
  • Electrical Testing
  • Optical Testing
  • Environmental Testing
  • functional testing
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Our Values

FROM R&D TO PRODUCTION

ACCESSIBLE AND DEDICATED ENGINEERING TEAM

SHORT LEAD TIMES

Partners

Our Blog

07.02.23 | Micro Optic / photonics

Chapter 1: Introduction to Microelectronic Packaging

Before we dive into terms like die attach, soldering, adhesives, flip-chip, active alignment, and other...

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07.02.23 | Micro Optic / photonics

Beckermus Technologies & ficonTEC to promote relationship

On a previous blog post we shared with our readers the new addition to our...

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