Beckermus Technologies establishes facility for the mass production of optical and microelectronic a
About us
Beckermus Technologies is a privately-owned company, our company provides advanced microelectronics & micro optics assembly services, we specializes in the assembly of complex electro-optic modules based on 'bare dies' from all sort of sectors and applications: from medical devices to communications, automotive, AR\VR, defense and more, our experience and expertise is in providing full TK solutions for start-ups and R&D teams from prototype level to mass production.
growing with this industry for so many years we have accumulated invaluable knowledge and insights which offer a distinct advantage to our customers.
We comply with ISO 13485 for Medical devices, AS9100D for aerospace as well as the IPC-A-610 & MILL-STD 883.
Micro Electronics
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Wire bonding
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Die Attach
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Flip chip
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Chip on board / Flex
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Inert soldering
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System in Package
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Multi chip modules
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Wafer Level packaging
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Encapsulation
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3D Stack dies
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Wafer dicing
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Wafer sorting
Short lead times
Micro Optics /Photonics
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Optical modules assembly
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Photonic components assembly
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6 Axis Automatic active alignment
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Fiber coupling
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High precision Lens placement and alignment
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Photodiodes, High power Lasers and LEDs
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MTF live measurements
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Custom optical alignment tools, jigs and software
accessible and dedicated engineering team
From R&D to
Production
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Contact Us
Beckermus Technologies Ltd
Building 1 -
Headquarter, NPI / R&D Center.
29 Ha-Eshel St. P.O. Box 3561
South Industrial Park Caesarea,
Israel , 3088900
Tel: +972-4-6230055
Fax: +972-4-6230083
E-mail: info@beckermus.com