Sip Design
System-in-Package (SiP) design is at the forefront of microelectronic innovation, integrating multiple components such as processors, memory, sensors, and RF modules into a single compact package.
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Beckermus technologies provides full in-house development of custom mechanical tooling, including jigs, fixtures, and pick-up head, specifically engineered to support the unique requirements of each assembly workflow. Our team collaborates closely across design and production to ensure that each tool is optimized for precision handling, accurate alignment, and smooth integration with automated and manual assembly stations. Equipped with dedicated CNC machining and advanced 3D printing facilities, we are able to rapidly prototype, iterate, and produce tooling solutions with high dimensional accuracy and robust mechanical performance. This capability not only improves the repeatability and efficiency of complex assembly tasks but also significantly reduces setup times and accelerates the transition from development to production.
Beckermus technologies provides full in-house development of custom mechanical tooling, including jigs, fixtures, and pick-up head, specifically engineered to support the unique requirements of each assembly workflow. Our team collaborates closely across design and production to ensure that each tool is optimized for precision handling, accurate alignment, and smooth integration with automated and manual assembly stations. Equipped with dedicated CNC machining and advanced 3D printing facilities, we are able to rapidly prototype, iterate, and produce tooling solutions with high dimensional accuracy and robust mechanical performance. This capability not only improves the repeatability and efficiency of complex assembly tasks but also significantly reduces setup times and accelerates the transition from development to production.
System-in-Package (SiP) design is at the forefront of microelectronic innovation, integrating multiple components such as processors, memory, sensors, and RF modules into a single compact package.
Read more
Beckermus Technologies specializes in designing advanced microelectronic packages that meet the demands of modern applications. From ceramic and organic packages to hybrid designs our expertise includes creating open cavity packages such
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Our electrical design expertise encompasses the development of circuit ladesigns that deliver peak performance and reliability. Wheyouts, signal integrity optimization,
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