The term wire bond or wire bonding is a Micro Assembly service used to describe the process of connecting between a bare die chip (IC) to a substrate, package or other die. In Beckermus Technologies, we supply the complete set of bonding services required for IC Assembly and use the most up-to-date machinery and bonding materials.

A partial list of our automated machines includes K&S ICONN Plus, ASM, and Delvotec.

Our supported  wire Bonding techniques  include Ball Bonding and Wedge Bonding supporting a variety of wire diameters in range of 0.7mil up to 2mil, based on project's specifications.

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Ball Bonding Services in Beckermus Technologies are available in gold wire and copper wire. The bonding can be performed in Fine Pitch between pads of up to 35 microns,  or a simple standard bond. The most prominent advantage of ball bonding stems from the ability to produce super complex wire loops with multiple tiers levels and crossing wires.

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Wedge Bonding Services  in Beckermus Technologies are available in gold wire and aluminum wire. Using aluminum instead of gold may reduce project costs.