Our Hybrid Flexible Electronics (HFE) Assembly Services offer innovative solutions for integrating printed electronic circuits with traditional components to create high-performance, flexible, and cost-effective devices. Specializing in the assembly of flexible circuits, sensors, and hybrid modules using sheet-to-sheet (S2S) and roll-to-roll (R2R) technology, we support applications across industries such as RFID and IoT technology, medical devices, automotive, and consumer electronics.
We offer a wide range of services for flexible substrates such as PET, PI, and other polymers, paired with rigid components. Our capabilities include precision soldering, adhesive bonding, surface-mount technology (SMT), and advanced interconnect technologies, including wire bonding and flip-chip bonding. These technologies ensure the seamless integration of flexible and rigid elements, ensuring durability, performance, and functionality for demanding applications.
Our RFID and IoT tag assembly expertise stands out, enabling the creation of high-performance tags for a wide variety of use cases, from supply chain tracking to smart devices.
our RFID testing capabilities are designed to ensure optimal performance and reliability of IoT tags and RFID solutions. We utilize advanced Voyantic systems for comprehensive tag characterization, including sensitivity, read range, and environmental performance testing. Additionally, our engineering team supports our customer’s custom-made testing platforms tailored to specific IoT applications, enabling precise validation and fine-tuning of IOT tag functionality. This combination of standardized and bespoke testing solutions ensures that we meet the diverse requirements of our clients across industries.
Our Hybrid Flexible Electronics (HFE) Assembly Services offer innovative solutions for integrating printed electronic circuits with traditional components to create high-performance, flexible, and cost-effective devices. Specializing in the assembly of flexible circuits, sensors, and hybrid modules using sheet-to-sheet (S2S) and roll-to-roll (R2R) technology, we support applications across industries such as RFID and IoT technology, medical devices, automotive, and consumer electronics.
We offer a wide range of services for flexible substrates such as PET, PI, and other polymers, paired with rigid components. Our capabilities include precision soldering, adhesive bonding, surface-mount technology (SMT), and advanced interconnect technologies, including wire bonding and flip-chip bonding. These technologies ensure the seamless integration of flexible and rigid elements, ensuring durability, performance, and functionality for demanding applications.
Our RFID and IoT tag assembly expertise stands out, enabling the creation of high-performance tags for a wide variety of use cases, from supply chain tracking to smart devices.
our RFID testing capabilities are designed to ensure optimal performance and reliability of IoT tags and RFID solutions. We utilize advanced Voyantic systems for comprehensive tag characterization, including sensitivity, read range, and environmental performance testing. Additionally, our engineering team supports our customer’s custom-made testing platforms tailored to specific IoT applications, enabling precise validation and fine-tuning of IOT tag functionality. This combination of standardized and bespoke testing solutions ensures that we meet the diverse requirements of our clients across industries.
Beckermus Technologies specializes in bare die assembly, Our advanced capabilities include handling ultra-miniature components, high-density interconnects, and direct die bonding to substrates or packages, Whether working with RF amplifiers, MEMS sensors, or microprocessors, with our expertise in precision wire bonding, die attach, and encapsulation, we ensure high reliability and performance tailored to demanding applications
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Our photonics assembly services are tailored to address the intricate challenges of integrating optical and electronic components with precision and reliability. We excel in assembling photonic ICs (PICs) & devices, including laser diodes, photodetectors, optical transceivers, fiber-coupled modules, and high-complexity optical systems. These assemblies are essential for applications
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