Our photonics assembly services are engineered to solve the complex challenges of integrating optical and electronic components with exceptional precision and reliability. We specialize in assembling a broad range of photonic devices and subsystems, including photonic integrated circuits (PICs), laser diodes, photodetectors, fiber-coupled modules and advanced optical systems, all commonly used in high-performance applications across telecommunications, medical technology, AR/VR, sensing, and beyond.
We are equipped to handle both hybrid and monolithic photonic integration, working with advanced materials such as silicon photonics, indium phosphide (InP), and gallium arsenide (GaAs). Leveraging state-of-the-art equipment, we perform sub-micron alignment, bonding, and packaging with both passive and active alignment techniques. Our active alignment capabilities enable real-time optical optimization during assembly, ensuring maximum coupling efficiency and performance for even the most demanding photonic interfaces.
Our modular, automated assembly platforms support precise and scalable production, while our in-house characterization tools cover comprehensive LED and laser testing, including Light-Current-Voltage (LIV), polarization, beam divergence, beam waist, and wavelength measurements.
At the heart of our operations is a skilled and dedicated engineering team who bring deep expertise in process development and custom solution design. From prototyping through to scalable high-volume manufacturing, we work closely with each client to refine processes, enhance performance, and bring innovative photonic products to market with confidence.
Our photonics assembly services are engineered to solve the complex challenges of integrating optical and electronic components with exceptional precision and reliability. We specialize in assembling a broad range of photonic devices and subsystems, including photonic integrated circuits (PICs), laser diodes, photodetectors, fiber-coupled modules and advanced optical systems, all commonly used in high-performance applications across telecommunications, medical technology, AR/VR, sensing, and beyond.
We are equipped to handle both hybrid and monolithic photonic integration, working with advanced materials such as silicon photonics, indium phosphide (InP), and gallium arsenide (GaAs). Leveraging state-of-the-art equipment, we perform sub-micron alignment, bonding, and packaging with both passive and active alignment techniques. Our active alignment capabilities enable real-time optical optimization during assembly, ensuring maximum coupling efficiency and performance for even the most demanding photonic interfaces.
Our modular, automated assembly platforms support precise and scalable production, while our in-house characterization tools cover comprehensive LED and laser testing, including Light-Current-Voltage (LIV), polarization, beam divergence, beam waist, and wavelength measurements.
At the heart of our operations is a skilled and dedicated engineering team who bring deep expertise in process development and custom solution design. From prototyping through to scalable high-volume manufacturing, we work closely with each client to refine processes, enhance performance, and bring innovative photonic products to market with confidence.
Our Hybrid Flexible Electronics (HFE) Assembly Services offer innovative solutions for integrating printed electronic circuits with traditional components to create high-performance, flexible, and cost-effective devices. Specializing in the assembly of flexible circuits, sensors, and hybrid modules using sheet-to-sheet (S2S) and roll-to-roll (R2R) technology, we support applications across industries such
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Beckermus Technologies specializes in bare die assembly, Our advanced capabilities include handling ultra-miniature components, high-density interconnects, and direct die bonding to substrates or packages, Whether working with RF amplifiers, MEMS sensors, or microprocessors, with our expertise in precision wire bonding, die attach, and encapsulation, we ensure high reliability and performance tailored to demanding applications
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